FLY905-JM88-T5 Solder Paste
The invention of POP (Package on Package) not only increased the flexibility of the choices of components, but also enhanced the control over production cost. For portable devices such as 3G/4G mobile phones and MP4, POP is definitely a technology one cannot overlook.
As the pioneer in this field, Yik Shing Tat had always focused on research and development. Back in 2008, our Soldering and Micro-joining R&D Center had already invented the solder paste dedicated for the POP technology: FLY905-JM88-T5.
As the pioneer in this field, Yik Shing Tat had always focused on research and development. Back in 2008, our Soldering and Micro-joining R&D Center had already invented the solder paste dedicated for the POP technology: FLY905-JM88-T5.
PRODUCT Info
YST presents, FLY905-JM88-T5, a solder paste dedicated to POP technology. With an alloy composition of Sn-3.0Ag-0.5Cu, it can be applied to components with distance down to 0.25mm without causing a bridging.
| Type | Alloy Composition | Powder Size | Melting Point | Density | Lead | Halogen |
| FLY905-JM88-T5 | Sn-3.0Ag-0.5Cu | Type 5 | 217~221 | 7.4±0.05 g/cm3 | Lead-free | Halogen-free |