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Dr. Yang Ming from R&D Department, invited to the 19th National Conference for Soldering and Welding
Published : 2014-09-20
The 19th National Conference for Soldering and Welding was held in Tianjin University of Technology from 18th to 22nd September 2014. Dr. Yang Ming of R&D Department was invited to the conference on behalf of the company for seminars on soldering by the Chinese Mechanical Engineering Society. Once again,this proved the strength of YST’s R&D team is well recognizedin the academic field.
The National Conference for Soldering and Welding has more than 50 years of history. Most recent research results and application on soldering and related fields will be the key content ofthe conference,it has been essential in boosting the development of the industry in China. Main themeof the 19th Conference was “The Technology and Application of Advanced Joining Materials –Environment, Health and Sustainability”. Several seminars for specific academic topics were held during the conference.
Dr. Yang Ming’s thesis “Textured growth behavior of intermetallic compounds formed at Sn-based solders/Cu interface during solid-state aging”was well recognized and adoptedby the official,related seminarswerearranged for discussionwith other professional researchers, contributing to the development of joining material researches in China.
The 19th National Conference for Soldering and Welding Held in Tianjin
Dr. Yang Ming, R&D Department of YST
Thesis discussion for Solder and Special Welding
The National Conference for Soldering and Welding has more than 50 years of history. Most recent research results and application on soldering and related fields will be the key content ofthe conference,it has been essential in boosting the development of the industry in China. Main themeof the 19th Conference was “The Technology and Application of Advanced Joining Materials –Environment, Health and Sustainability”. Several seminars for specific academic topics were held during the conference.
Dr. Yang Ming’s thesis “Textured growth behavior of intermetallic compounds formed at Sn-based solders/Cu interface during solid-state aging”was well recognized and adoptedby the official,related seminarswerearranged for discussionwith other professional researchers, contributing to the development of joining material researches in China.
The 19th National Conference for Soldering and Welding Held in Tianjin
Dr. Yang Ming, R&D Department of YST
Thesis discussion for Solder and Special Welding
Professor He Peng (Deputy Director of State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology), Technical Consultant of YST pictured with Dr. Yang